Summary
This proposal seeks to fund US-based students to attend IEEE DySPAN 2026, held in Washington, DC on May 11-14, 2026. DySPAN is a premier conference focused on enhancing spectrum innovation to address the increasing need for wireless capacity across various applications. The conference brings together researchers, engineers, policymakers, and industry professionals to discuss the latest developments, challenges, and innovations in dynamic spectrum access and related areas. DySPAN 2026 will expose selected students to cutting-edge developments in the field and enable interactions with world-lead
